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Fully Automatic Developing and Cleaning Equipment

Fully Automatic Developing and Cleaning Equipment

Suitable for: 8-12 inch wafer platingEquipment features:1. Using a 10.4-inch PROFACE touch screen human-machine interface for operation and Mitsubishi PLC control2. Pre treatment tank: 10mm German Rol...

Suitable for: 8-12 inch wafer plating

Equipment features:

1. Using a 10.4-inch PROFACE touch screen human-machine interface for operation and Mitsubishi PLC control

2. Pre treatment tank: 10mm German Roland PP-N plate welded

3. QDR groove: Made of 10mm PP-N plate imported from Germany by hot melt welding

4. Nickel plating tank: 2mm thick Korean POSCO SUS316 board welding and electrolytic polishing

5. Tank body setting temperature and liquid level monitoring device

6. The cleaning area is equipped with high-efficiency filters, which have no chance of secondary pollution

7. Use corrosion-resistant wires and protect them with corrosion-resistant PE pipes, anti-corrosion and waterproof

8. The entire process automation control after feeding has the characteristics of high automation, low operating costs, high production efficiency, and stable performance

9. The equipment has high safety performance and has been strictly designed in terms of anti leakage, heating, and leakage to ensure personal and factory safety

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